The future of energy storage is greener cleaner devices that do not need replacement for the life of the end product and can be scaled with the application and usage patterns. The company is committed to making devices that are environmentally friendly and can be manufactured at scale in the USA.
Important system-level reductions in mass and volume are possible by simultaneously offering energy storage capabilities with structural mechanical properties in multi-functional materials. The breakthrough of the PowerWrapper™ technology platform, invented in the company, is to design "strength with energy" with all components contributing to both mechanical properties and energy storage, removing the need for rigid packaging and allowing for integration into end products. In contrast, systems that simply combine structural elements with separate power and energy devices, such that each set of materials are functionally independent, provide no advantages in system efficiency.
The company will commercialize first products in selected electronics and computing industry applications to gain early revenues, while continuing its development focus on large-scale, high volume deployments. For example, large scale building integrated (PowerWrapper™) structural sheeting can now be massively networked through the smart grid to smooth variability in local renewable generation.

Power cell in laptop casing

Power cell in car hood

Power cell in roof
The company’s innovation is a novel architecture and production process for supercapacitor technology, extensible to battery technology as well. The first product line, called PowerPatch™, is an ultrathin, integrated supercapacitor that can scale voltage, energy and power in a single unit, addressing the growing needs for high power in smaller size and lower weight devices. A transformational approach to the production process has led to a highly differentiated architecture that builds the devices as planar sheets. This technology platform is called the PowerWrapper™ technology.
For applications in the electronics markets, the market game changer is integration of the technology directly into or as printed circuit board layers, reducing component count and revolutionizing power distribution and management in a broad array of electronics products. The form factor can scale in structural elements ranging from solar energy array backplanes for smoothing out variability to HEV body panels that can capture and reuse regenerative braking energy.
By combining weight bearing and energy storage, a system-integrated approach to power management is possible, with power accessible at multiple points of use throughout the surface area of the device. This transformational technology now integrates new stakeholders in system energy management, such as architects, industrial designers, mechanical or civil engineers and system integrators, who can specify and buy a structural material that provides local power access. The PowerWrapper™ platform opens new market applications with its unique structurally-integrated deployment, performance and cost model.
The PowerWrapper™ is made by print-forming complex, fully functional, components like electrodes and a porous separator in situ, using techniques compatible with high volume roll to roll printing methods. However, unlike most other printed devices, the PowerWrapper™ is not built around any starting web or paper sheet. The entire integrated device is print-formed from particles, resulting in unprecedented design control to tune the mechanical and storage properties of the sheet to the desired application. Designed to be 'cut to fit,' the unit device can be shaped and sized specifically to the power storage and shape desired, including patterned holes. These processes thus enable addressable power cells or entire power planes to be built based on OEM specifications.
The company has built its own patent portfolio on the PowerWrapper™ technology platform and also holds worldwide exclusive rights to the background patent filed by Rensselaer Polytechnic Institute.
The PowerPatch™ line of products is designed as an ultrathin module with interconnects and packaging designed to the deployment and environment and is scalable in voltage and energy as required. Thinner than the state of the art devices in the market, the PowerPatch™ packaging efficiencies achieve 30-50% higher energy density at higher voltages between 5 and 12 volts. Prototypes are available for testing with selected strategic partners.